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On November 14, 2024, as part of the Japan-U.S. semiconductor partnership ¡°UPWARDS for the Future¡± project, the 3rd UPWARDS U.S.-Japan Meeting was held at Â鶹AV (HU), bringing together about 75 representatives from 11 U.S. and Japanese universities, Micron and Tokyo Electron. This project was initiated with the conclusion of a memorandum of understanding at the G7 Hiroshima Summit in May 2023, with the aim of strengthening next-generation human resource development and R&D in the semiconductor field.

This five-year collaboration between 5 universities in Japan and 6 universities in the U.S. aims to develop semiconductor technology and foster diverse human resources. The initiatives of this project consist of the following 6 pillars: (1) curriculum design, (2) support for women in the semiconductor field, (3) experiential learning (laboratory training), (4) research and development of non-IP, (5) student and faculty exchange, and (6) program management.

On November 13, the day before the meeting, participants visited the Micron Hiroshima Plant in Higashihiroshima City to see the latest semiconductor manufacturing technology in action. Participants witnessed cutting-edge technological innovations and were reminded of the importance of R&D and human resource development.

In the evening of the same day, a welcome reception was held in Hiroshima City. About 90 participants gathered in an atmospheric venue surrounded by a beautiful Japanese garden and brightly decorated with the autumn leaves at their best. Participants enjoyed the seasonal beauty of the uniquely Japanese garden and a moment of warm exchange.

At the beginning of the reception, HU President Mitsuo Ochi gave the opening remarks and toasted the participants, warmly welcoming them to the event. President Ochi noted that the ¡°UPWARDS for the Future¡± project began with the G7 Hiroshima Summit in 2023 and is now in its second year, and praised the deep cooperation between the U.S. and Japan in the semiconductor field.

H.E. Rahm Emanuel, Ambassador Extraordinary and Plenipotentiary of the United States of America to Japan, sent a special video message, expressing his high appreciation for the progress of the project and his expectations for the future.
Then, Mr. Takashi Kiyoura, Deputy Director-General, Research and Development Bureau, Ministry of Education, Culture, Sports, Science and Technology; Ms. Fran Dillard, Vice President and Chief Diversity Inclusion Officer, Micron; Mr. Kazuhiro Doh, Division Officer, Tokyo Electron; and Mr. Jason R. Cubas, Consul General, U.S. Consulate General Osaka-Kobe, addressed the audience in turn and explained the significance of the project and its future prospects. In addition, a video message from Mr. Hisashi Kanazashi, Director, IT Industry Division, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry, was shown, reiterating the strong support from government officials in both Japan and the United States. Lastly, HU Executive Vice President (Global Initiatives) Shinji Kaneko concluded the reception with closing remarks and enthusiasm for the next day's conference.

During the Discussion

HU has nurtured the longest history of any national university in Japan as a center for semiconductor education and research. It has positioned research and development of semiconductors as an important strategic business pillar, including the opening in April 2023 of a base on its Higashi-Hiroshima campus for the ¡°Setouchi Semiconductor Consortium,¡± a joint industry-government-academia effort to develop semiconductors. Through this innovative partnership, HU will further contribute to the diversification and advancement of semiconductor technology and the development of professional human resources in Japan and the United States.